EXAKT Cutting, Grinding & Thin Section Technology

Our clients achieve material thicknesses down to 100 µm using the EXAKT thin section cutting technology - without damaging the composition,surface, or structure of the material.

Using a reduced energy input prevents deformations,crushing or stresses to the material during processing. The sample information content always remains intact. At the same time the risk of injury is minimal for operators.

The pathology saw EXAKT 312 and the laboratory saw EXAKT 302 were specifically developed to meet the requirements in pathology and anatomy labs and departments. Due to the excellent surface quality of the cutting surface, an initial assessment of the section can be carried out without further processing. The high cutting quality also applies to bones with implants. Using a diamond cutting band allows for thin cuts by hand and without any risk of cutting to the operator. The straightforward and application-oriented design ensures easy cleaning and disinfection after use.

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Create μ-accurate and reproducible plane-parallel thin sections with the EXAKT 400 CS grinder. Our precise measuring technology allows you to accurately set the required material removal. The grinding and polishing processes are achieved with an accuracy of less than 5 μm depending on the selected type and fineness of the sandpaper. Follow the EXAKT sample preparation system to determine the adhesive layer thickness of the embedded samples fixed to slides. In combination with the EXAKT 400CS grinder, this process allows the safe production of thin sections down to 10 μm thickness.

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